Bipolar plate assembly, fuel cell stacks and fuel cell systems incorporating the same

ABSTRACT

A layered bipolar plate assembly and fuel cell stacks and fuel cell systems incorporating the same. In some embodiments, the bipolar plate assembly includes a structural metal that provides strength to the assembly and a conductive metal that provides favorable electrical conductivity. In some embodiments, the structural metal is diffusion bonded to the conductive metal to decrease the electrical resistance between the structural metal and the conductive metal. A flow field established on the surface of the bipolar plate assembly is present in some embodiments. The flow field may be established by sacrificially etching the conductive metal with an etchant configured to etch the conductive metal while leaving the structural metal at most substantially unetched. Methods for forming the bipolar plate assemblies and fuel cell systems including fuel cell stacks with the bipolar plate assemblies are also disclosed.

RELATED APPLICATIONS

This application is a divisional patent application of and claimspriority to U.S. patent application Ser. No. 10/153,282, which was filedon May 21, 2002, issued on Feb. 22, 2005 as U.S. Pat. No. 6,858,341, andthe complete disclosure of which is hereby incorporated by reference forall purposes.

TECHNICAL FIELD

The invention relates generally to fuel cell systems, and moreparticularly to bipolar plates for fuel cell systems and fuel cellsystems incorporating the same.

BACKGROUND OF THE INVENTION

An electrochemical fuel cell is a device that converts fuel and anoxidant to electricity, reaction product, and heat. Fuel cells commonlyare configured to convert hydrogen and oxygen into water andelectricity. In such fuel cells, the hydrogen is the fuel, the oxygen isthe oxidant, and the water is the reaction product.

The amount of electricity produced by a single fuel cell may besupplemented by connecting several fuel cells together. Fuel cellsconnected together in series are often referred to as a fuel cell stack.Some fuel cell stacks include membrane-electrode assemblies that areseparated by electrically conductive bipolar plates that electricallyconnect a cathode of one fuel cell to an anode of another. The platesalso usually provide structural support to adjacent membrane-electrodeassemblies. Furthermore, the plates commonly provide fuel and an oxidantto membrane-electrode assemblies while removing water and heattherefrom.

SUMMARY OF THE INVENTION

The present invention is directed to a layered bipolar plate assemblyand to fuel cell stacks and fuel cell systems incorporating the same. Insome embodiments, the bipolar plate assembly includes a structural metalthat provides strength to the assembly and a conductive metal thatprovides favorable electrical conductivity. In some embodiments, thestructural metal is diffusion bonded to the conductive metal to decreasethe electrical resistance between the structural metal and theconductive metal. A flow field established on the surface of the bipolarplate assembly is present in some embodiments. The flow field may beestablished by sacrificially etching the conductive metal with anetchant configured to etch the conductive metal while leaving thestructural metal at most substantially unetched. Methods for forming thebipolar plate assemblies and fuel cell systems including fuel cellstacks with the bipolar plate assemblies are also disclosed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a fuel cell stack incorporating aplurality of bipolar plate assemblies according to the presentinvention.

FIG. 2 is a schematic view of a proton exchange membrane fuel cell.

FIG. 3 is a schematic fragmentary view of a plurality of fuel cells, asmay be used in fuel cell stacks according to the present invention.

FIG. 4 is an exploded schematic view of a fuel cell, as may be used infuel cell stacks according to the present invention.

FIG. 5 is a schematic fragmentary view of a portion of a bipolar plateassembly configured for use in fuel cell stacks according to the presentinvention.

FIG. 6 is a schematic fragmentary view of a portion of another bipolarplate assembly configured for use in fuel cell stacks according to thepresent invention.

FIG. 7 is a schematic fragmentary view of a portion of another bipolarplate assembly configured for use in fuel cell stacks according to thepresent invention.

FIG. 8 is a schematic fragmentary view of a portion of another bipolarplate assembly configured for use in fuel cell stacks according to thepresent invention.

FIG. 9 is a schematic fragmentary view of illustrative coolant units, asmay be used in fuel cell stacks according to the present invention.

FIG. 10 is a schematic cross section view of another bipolar plateassembly configured for use in fuel cell stacks according to the presentinvention.

FIG. 11 is a schematic microscopic view of a portion of an uncladbipolar plate assembly constructed according to the present invention.

FIG. 12 is a schematic microscopic view of a portion of a clad bipolarplate assembly constructed according to the present invention takenalong the line 11–12 in FIG. 5.

FIG. 13 is a schematic view demonstrating a method of forming a portionof a bipolar plate assembly by cladding a conductive layer to astructural layer.

FIG. 14 is a schematic view demonstrating a method of forming a portionof a bipolar plate assembly by cladding two conductive layers toopposite faces of a structural layer.

FIG. 15 is a schematic fragmentary view of a portion of a bipolar plateassembly before a flow field has been etched into the bipolar plateassembly.

FIG. 16 is a schematic view of a portion of a bipolar plate assemblyafter a flow field has been etched into a conductive layer of thebipolar plate assembly.

FIG. 17 shows a method of constructing a bipolar plate assembly.

FIG. 18 is a schematic view of a fuel cell system that includes a fuelcell stack with bipolar plate assemblies according to the presentinvention.

FIG. 19 is a schematic view of another fuel cell system that includes afuel cell stack with bipolar plate assemblies according to the presentinvention.

FIG. 20 is a schematic view of a fuel processor that may be used withfuel cell systems according to the present invention.

FIG. 21 is a schematic view of another fuel processor that may be usedwith fuel cell systems according to the present invention.

DETAILED DESCRIPTION AND BEST MODE OF THE INVENTION

FIG. 1 schematically depicts a fuel cell stack 10. Stack 10 includes endplates 12 and 14 positioned on opposite ends of the stack. Stack 10 alsoincludes a plurality of fuel cells, or fuel cell assemblies, 16, whichare physically arranged between end plates 12 and 14. Each cell isindividually configured to convert fuel and an oxidant into an electriccurrent. The fuel cells are electrically coupled in series, although itis within the scope of the invention to couple the cells in parallel orin a combination of series and parallel. When electrically coupled, thecells collectively provide an electric potential dependent on theconfiguration of the stack. For example, if all cells are electricallycoupled in series, the electrical potential provided by the stack is thesum of the cells' respective potentials. Stack 10 is shown with positivecontact 18 and negative contact 20, across which a load 22 may beelectrically coupled. It should be understood that contacts 18 and 20have been schematically depicted in FIG. 1 and may be accessible from avariety of locations. Similarly, the number of fuel cells 16 in anyparticular stack may vary, such as depending upon the desired poweroutput of the fuel cell stack.

The subsequently discussed bipolar plates, or bipolar plate assemblies,constructed according to the present invention are compatible with avariety of different types of fuel cells, such as proton exchangemembrane (PEM) fuel cells, as well as alkaline fuel cells, phosphoricacid fuel cells, and other fuel cells that utilize bipolar plateassemblies. For the purpose of illustration, an exemplary fuel cell 16in the form of a PEM fuel cell is schematically illustrated in FIG. 2and generally indicated at 24. Proton exchange membrane fuel cellstypically utilize a membrane-electrode assembly 26 consisting of an ionexchange, or electrolytic, membrane 28 located between an anode region30 and a cathode region 32. Each region 30 and 32 includes an electrode34, namely an anode 36 and a cathode 38, respectively. Each region 30and 32 also includes a supporting plate 40, such as at least a portionof the bipolar plate assemblies that are discussed in more detailherein.

In operation, hydrogen 42 is fed to the anode region, while oxygen 44 isfed to the cathode region. Hydrogen 42 and oxygen 44 may be delivered tothe respective regions of the fuel cell via any suitable mechanism fromsources 46 and 48. Examples of suitable sources 46 for hydrogen 42include a pressurized tank, hydride bed or other suitable hydrogenstorage device, and/or a fuel processor that produces a streamcontaining hydrogen gas. Examples of suitable sources 48 of oxygen 44include a pressurized tank of oxygen or air, or a fan, compressor,blower or other device for directing air to the cathode region. Hydrogenand oxygen typically combine with one another via an oxidation-reductionreaction. Although membrane 28 restricts the passage of a hydrogenmolecule, it will permit a hydrogen ion (proton) to pass therethrough,largely due to the ionic conductivity of the membrane. The free energyof the oxidation-reduction reaction drives the proton from the hydrogengas through the ion exchange membrane. As membrane 28 also tends not tobe electrically conductive, an external circuit 50 is the lowest energypath for the remaining electron, and is schematically illustrated inFIG. 2. In practice, a fuel cell stack contains a plurality of fuelcells with bipolar plate assemblies, as will be discussed in more detailsubsequently, separating adjacent membrane-electrode assemblies. Thebipolar plate assemblies essentially permit the free electron to passfrom the anode region of a first cell to the cathode region of theadjacent cell via the bipolar plate assembly, thereby establishing anelectrical potential through the stack that may be used to satisfy anapplied load. This net flow of electrons produces an electric currentthat may be used to satisfy an applied load. At least oneenergy-consuming device 52 may be electrically coupled to the fuel cell,or more typically, the fuel cell stack. Device 52 applies a load to thecell/stack and draws an electric current therefrom to satisfy the load.Illustrative examples of devices 52 include motor vehicles, recreationalvehicles, boats and other seacraft, tools, lights and lightingassemblies, signaling and communications equipment, batteries and eventhe balance-of-plant electrical requirements for the fuel cell system ofwhich stack 10 forms a part.

In cathode region 32, electrons from the external circuit and protonsfrom the membrane combine with oxygen to produce water and heat. Alsoshown in FIG. 2 are an anode purge stream 54, which may contain hydrogengas, and a cathode air exhaust stream 55, which is typically at leastpartially, if not substantially, depleted of oxygen. It should beunderstood that fuel cell stack 10 will typically have a common hydrogen(or other reactant) feed, air intake, and stack purge and exhauststreams, and accordingly will include suitable fluid conduits to deliverthe associated streams to, and collect the streams from, the individualcells.

FIG. 3 shows a schematic representation of a fragmentary portion 10′ offuel cell stack 10. As shown, portion 10′ includes a plurality of fuelcell assemblies, including fuel cell assemblies 16′ and 16″. Fuel cellassembly 16′ includes a membrane-electrode assembly (MEA) 56 positionedbetween a pair of bipolar plate assemblies 57, such as assemblies 58 and60. Similarly, fuel cell assembly 16″ includes an MEA 62 positionedbetween a pair of bipolar plate assemblies 57, such as bipolar plateassemblies 60 and 64. Therefore, bipolar plate assembly 60 isoperatively interposed between adjacently situated MEAs 56 and 62.Additional fuel cells may be serially connected in similar fashion,wherein a bipolar plate may be operatively interposed between adjacentMEAs. The phrase “working cell” is used herein to describe fuel cells,such as cells 16′ and 16″, that are configured to produce electriccurrent and typically include an MEA positioned between bipolar plateassemblies.

FIG. 4 shows an exploded schematic view of fuel cell assembly 16″, whichas discussed includes a membrane-electrode assembly (MEA) 62 positionedbetween bipolar plate assemblies 60 and 64. MEA 62 includes an anode 66,a cathode 68, and an electron barrier 70 that is positionedtherebetween. Electron barrier 70 may include any suitable structureand/or composition that enables protons to pass therethrough and yetretards the passage of electrons to bias the electrons to an externalcircuit. As an illustrative example, barrier 70 may include amembrane-supported electrolyte that is capable of blocking electrons,while allowing protons to pass. For example, in PEM fuel cells, electronbarrier 70 may be a polymer membrane 72 configured to conduct hydrogencations (protons) and inhibit electron flow, and as such may also bedescribed as an ion exchange membrane. In an alkaline fuel cell,electron barrier 70 may be an aqueous alkaline solution or membrane. Forphosphoric acid fuel cells, electron barrier 70 may be a phosphoric acidsolution (neat or diluted) or membrane.

For at least PEM fuel cells, the electrodes, such as anode 66 andcathode 68, may be constructed of a porous, electrically conductivematerial such as carbon fiber paper, carbon fiber cloth, or othersuitable materials. Catalysts 74 and 76 are schematically depicted asbeing disposed between the electrodes and the electron barrier. Suchcatalysts facilitate electrochemical activity and are typically embeddedinto barrier 70, such as into membrane 72. Cell 16″ will typically alsoinclude a gas diffusion layer 78 between the electrodes and catalysts 74and 76. For example, layer 78 may be formed on the surface of theelectrodes and/or the catalysts and may be formed from a suitable gasdiffusing material, such as a thin film of powdered carbon. Layer 78 istypically treated to be hydrophobic to resist the coating of the gasdiffusion layers by water present in the anode and cathode regions,which may prevent gas from flowing therethrough. It should be understoodthat it is desirable to have a fluid seal between adjacent bipolar plateassemblies. As such, a variety of sealing materials or sealingmechanisms 80 may be used at or near the perimeters of the bipolar plateassemblies. An example of a suitable sealing mechanism 80 is a gasket 82that extends between the outer perimeters of the bipolar plateassemblies and barrier 70. Other illustrative examples of suitablesealing mechanisms 80 are schematically illustrated in the lower portionof FIG. 3 and include bipolar plate assemblies with projecting flanges84, which extend into contact with barrier 70, and/or a barrier 70 withprojecting flanges 86 that extend into contact with the bipolar plateassemblies. In some embodiments, it may be desirable for the cells toinclude a compressible region between adjacent bipolar plate assemblies,with gaskets 82 and membranes 72 being examples of suitable compressibleregions that permit the cells, and thus the stack, to be more tolerantand able to withstand external forces applied thereto.

As shown in FIG. 4, bipolar plate assemblies 60 and 64 extend alongopposite sides of MEA 62 so as to provide structural support to the MEA.Such an arrangement also allows the bipolar plate assemblies to providea current path between adjacently situated MEAs. Bipolar plateassemblies 60 and 64 are shown with flow fields 87, namely anode flowfields 88 and cathode flow fields 90. Flow field 88 is configured totransport fuel, such as hydrogen, to the anode. Similarly, flow field 90is configured to transport oxidant, such as oxygen, to the cathode andto remove water and heat therefrom. The flow fields also provideconduits through which the exhaust or purge streams may be withdrawnfrom the fuel cell assemblies. The flow fields typically include one ormore channels 92 that are at least partially defined by opposingsidewalls 94 and a bottom, or lower surface, 96. It should be understoodthat flow fields 88 and 90 have been schematically illustrated in FIG. 4and may have a variety of shapes and configurations. Similarly, thechannels 92 in a given flow field may be continuous, discontinuous, ormay contain a mix of continuous and discontinuous channels. Examples ofa variety of flow field configurations are shown in U.S. Pat. Nos.4,214,969, 5,300,370, and 5,879,826, the complete disclosures of whichare herein incorporated by reference for all purposes.

As also shown in FIG. 4, the bipolar plate assemblies may include bothanode and cathode flow fields, with the flow fields being generallyopposed to each other on opposite faces of the bipolar plate assemblies.This construction enables a single bipolar plate assembly 57 to providestructural support and contain the flow fields for a pair of adjacentMEAs. For example, as illustrated in FIG. 4, bipolar plate assembly 60includes anode flow field 88 and a cathode flow field 90′, and bipolarplate assembly 64 includes cathode flow field 90 and an anode flow field88′. Although many, if not most or even all of the bipolar plateassemblies within a stack will have the same or a similar constructionand application, it is within the scope of the invention that not everybipolar plate assembly within stack 10 contains the same structure,supports a pair of MEAs or contains oppositely facing flow fields.

FIG. 5 shows a schematic cross section of a bipolar plate assembly 57constructed according to the present invention. As shown, bipolar plateassembly 57 includes a structural layer 98 of a structural metal 100. Asused herein, the term “metal” is meant to include a pure metal,substantially pure metal, metal alloy, and/or a hybrid combination of atleast two of the preceding. Structural metal 100 typically is selectedfrom metals with high strength-to-weight ratios. An example of asuitable structural metal 100 is titanium, although it is within thescope of the invention to use titanium alloys, vanadium, vanadiumalloys, or other metals that are relatively light and strong and whichpreferably are stable (unreactive) within the operating parameters andenvironments encountered in fuel cell stack 10. Metals with a highstrength-to-weight ratio are selected to increase the strength of thefuel cells while keeping the weight relatively low and the size of thefuel cell relatively small compared to cells that utilize structuralmetals with lower strength-to-weight ratios. These metals mayadditionally or alternatively be described as providing an equivalentstrength, or structural support, to the cells while having acomparatively lower weight than plates formed from materials, such asstainless steel or even aluminum, with lower strength-to-weight ratios.Titanium is particularly well suited because of its favorablecombination of high strength and light weight. The thickness ofstructural layer 98 is selected according to a particular desiredapplication. Thinner structural layers 98 result in relatively lighterand smaller fuel cell stacks compared to similarly configured stacksutilizing thicker structural layers of the same structural metal.Thicker structural layers 98 result in fuel cell stacks with morestructural integrity than similarly configured stacks utilizing thinnerstructural layers of the same structural metal. It has been found that athickness between 0.01 and 0.1 inches is suitable for most applicationswhen titanium is selected as structural metal 100. However, a structurallayer thickness of less than 0.01 inches is within the scope of theinvention, as is a structural layer with a thickness that is selected tobe greater than 0.1 inches, such as when increased strength is desired.

Bipolar plate assembly 57 also includes a conductive layer 102 of aconductive metal 104. Conductive metal 104 typically is selected frommetals with low electrical contact resistances to facilitate anefficient current path between adjacent MEAs. In particular, conductivemetal 104 typically has a lower electrical contact resistance thanstructural metal 100, and although not required, also typically has alower relative strength-to-weight ratio. An example of a suitableconductive metal 104 is stainless steel, although it is within the scopeof the invention to use other metals with good electrical conductingproperties. Stainless steel is particularly well suited because of itsfavorable properties as an electrical conductor and its ability to avoidforming oxide layers that may decrease surface conductivity. Thethickness of conductive layer 102 is selected according to a particulardesired application. Thinner conductive layers result in relativelylighter and smaller fuel cell stacks compared to similarly configuredfuel cell stacks utilizing thicker conductive layers of the sameconductive metal. As described below, in many configurations thethickness of the conductive layer determines the depth of the flowfield, and therefore is selected to achieve a desired flow field depth.It has been found that a thickness between 0.01 and 0.1 inches issuitable for most applications when stainless steel is selected asconductive metal 104. However, a conductive layer thickness of less than0.01 inches is within the scope of the invention, as is a conductivelayer with a thickness that is selected to be greater than 0.1 inches,such as when a deeper flow field is desired.

In FIG. 5, a flow field 87 is schematically illustrated extending intoconductive layer 102 of bipolar plate assembly 57. For example,depending upon the construction and orientation of the fuel cell stackin which plate assembly 57 is used, flow field 87 may be an anode flowfield, a cathode flow field, or as discussed in more detail herein, theflow field may form a portion of a cooling assembly, or cooling unit.Although a variety of mechanisms, including stamping and coining, may beused to form flow field 87 within the scope of the invention, aparticularly well-suited method is to chemically, or sacrificially, etchthe flow field into the conductive layer. The arrangement, pattern,locations of ingress and egress, and other aspects of the flow field arehighly customizable, and may be adapted to a particular application. Itshould be understood that the bipolar plate assemblies, flow fields,MEAs, and other aspects of the fuel cell stack are schematicallydepicted herein for purpose of illustration. For example, in theillustrated embodiment, flow field 87 extends completely throughconductive layer 102 but does not extend into structural layer 98. It isalso within the scope of the invention that the flow field may notextend completely through the conductive layer and that the flow fieldmay extend partially into the structural layer, such as indicated indash-dot and dashed lines in FIG. 5.

In FIG. 5, bipolar plate assembly 57 also includes a second conductivelayer 108, although second conductive layer 108 may not be necessary forcertain applications. When present, second conductive layer 108typically is made of conductive metal 104, although it is within thescope of the invention that a different metal may be used, as indicatedin dashed lines at 104′. The metal selected for layer 108 typically hasa relatively low electrical contact resistance compared to structuralmetal 100. In other words, conductive metal 104 preferably has a lowerelectrical contact resistance than structural metal 100. For example,many stainless steels, such as Type 304, 310 and 316 stainless steelshave a lower electrical contact resistance than titanium. Whenconductive layers are mounted on the opposing sides, or faces, of thestructural layer, the structural layer may be described as being astructural core.

As also shown in FIG. 5, a second flow field 87′ is set within thesecond conductive layer, such as by being chemically etched, stamped,coined, or otherwise configured to extend into the second conductivelayer. As shown, the flow field 87′ has the same configuration as flowfield 87. It is within the scope of the invention, that flow fields 87and 87′ may have essentially the same configuration, with differenceslargely being due to variances induced by the mechanism by which theflow fields are created, or that the flow fields may have differentconfigurations, such as with one of flow fields 87 and 87′ having agreater or smaller depth, width, continuity, or number of channels perside. Examples of bipolar plate assemblies 57 with these configurationsare schematically illustrated in FIGS. 6 and 7. In FIG. 6, the channelsforming flow fields 87 and 87′ have different depths, as measuredbetween bottom 96 and the corresponding inlets 110 to the channels. InFIG. 7, flow fields 87 and 87′ have different widths, as measuredbetween opposed sidewalls 94.

As still another option, flow fields 87 and 87′ may each include atleast one region 112 that is symmetrical with the corresponding regionof the other flow field, and at least one region 114 that is notsymmetrical with each other, such as schematically illustrated in FIG.8. FIG. 8 also provides a graphical illustration of the fact that thebipolar plate assemblies 57 that include opposed conductive layers 102and 108 that extend on both sides of a structural layer 98 may, but arenot required to, further include a bridge, or electrically conductivelinkage, or interconnect, 116 that extends between the conductive layersand is formed from a material other than structural metal 100. Forexample, linkage 116 may extend along at least a portion, spaced-apartportions, or the entirety, of the perimeter of the layers, or at anyother suitable location. When present, linkage 116 will typically beformed from one of the electrically conductive metals 104 and 104′,although others may be used. It should be understood that any of theexemplary flow field configurations described and/or illustrated abovemay include flow fields that extend into the corresponding conductivelayer, through the corresponding conductive layer but not into thestructural layer, or through the corresponding conductive layer and intothe structural layer, such as described with respect to FIG. 5.

When the flow fields on each plate have the same or approximately thesame configuration, the plates will have symmetry between the opposingsides of structural layer 98 and in some embodiments may be able to beassembled into fuel cell stacks without requiring side-specificreferences. By this it is meant that a particular side of the plateassembly may be used to support either a cathode or an anode electrode,depending upon the orientation of the plate assembly relative to theMEAs supported by the plate assembly. Alternatively, in someembodiments, it may be desirable for the flow fields to have differentconfigurations, such as to provide for different flow patterns orcross-sectional areas between the anode-facing flow field and thecathode-facing flow field. For example, flow field 87 may be adapted todeliver hydrogen fuel to an anode, while flow field 87′ may be adaptedto deliver oxygen to a cathode while removing water therefrom. As usedherein, a side of a bipolar plate assembly that extends into, or bounds,the anode region of a fuel cell may be referred to as an anode-sideplate, or an anode-interfacing portion of the bipolar plate assembly.Similarly, the side of a bipolar plate assembly that extends into, orbounds, the cathode region of a fuel cell may be referred to as acathode side plate, or a cathode-interfacing portion of the bipolarplate assembly. Similarly, the conductive layers from which the flowfields are formed may respectively be referred to as anode-interfacingand cathode-interfacing layers.

Operation of fuel cell stack 10 may increase the temperature of thestack. The increased temperature may have a negative effect on stackoperation and/or contribute to other undesirable conditions. It has beenfound that removing excess heat from fuel cell stack 10 may improve theperformance and increase the reliability of the stack. Heat may beremoved from the stack via cooling assemblies 120, which are adapted todeliver a heat exchange fluid into thermal communication with the stack,whereby the fluid may remove heat from the stack, or alternatively addheat to the stack. Illustrative examples of cooling assemblies 120 areshown in FIG. 9. As the conduits may be utilized, in at least someembodiments, to provide heat to stack 10, such as to thaw a frozenstack, the cooling assemblies may also be referred to as heat transferconduits.

FIG. 9 shows a schematic representation of a fragmentary portion 10″ offuel cell stack 10, with several illustrative examples of coolingassemblies 120 shown for purposes of illustration. At 122, a pair ofbipolar plate assemblies 57 are positioned similar to their expectedposition for a working cell, however, no membrane-electrode assemblyextends between the bipolar plate assemblies. Instead, the plates abutand the flow fields of the plates define conduits 124 through which aheat exchange fluid may be passed to selectively increase or decreasethe temperature of the bipolar plate assemblies (and often adjacentstructures). Examples of suitable heat exchange fluids include variousgases and liquids, including air, water, oil, and glycols. The heatexchange fluid is typically pumped or otherwise propelled through theconduits by a suitable delivery system. The flow rate of the heatexchange fluid may be selectively controlled so that the heat exchangefluid has time to efficiently absorb or deliver heat without becomingeffectively saturated with or depleted of heat.

Although schematically depicted as the same size as the flow fieldchannels in FIG. 9, it is within the scope of the invention that thebipolar plate assemblies may be configured so that conduits 124 areselectively larger or smaller than the flow field channels used inworking cells. As an additional example, it may be desirable to use adifferent flow field configuration for conduits 124, such as to selectthe path along which the heat exchange fluid will travel as itstemperature is selectively increased or decreased.

In FIG. 9, further examples of bipolar plate assemblies 57 are shown. Asshown at 126, the plate assembly includes opposing faces 128 that definea conduit 124 extending along at least a substantial portion, if not allor approximately all, of the surfaces of the faces. Although faces 128are spaced-apart from each other, the plate assemblies remain inelectrical communication by linkages 116. A further example of asuitable cooling assembly 120 is generally indicated at 130 in FIG. 9.As shown, bipolar plate assembly 57 includes at least one conduit 124extending through the plate assembly, such as through its structurallayer. Conduit 124 may extend in a linear and/or a nonlinear path, andcooling assembly 120 may include more than one conduit 124 extendingthrough a single bipolar plate assembly. Similarly, when fuel cell stack10 includes a cooling assembly 120, it may include one or more differenttypes of cooling assemblies. Furthermore, the frequency and positioningof the cooling assemblies may vary within the stack, such as betweeneach working cell, between every other working cell, or periodically orirregularly spaced amongst the working cells. It is within the scope ofthe invention to use other mechanisms to cool fuel cell stack 10, suchas those shown in U.S. Pat. Nos. 4,583,583 and 5,879,826, the completedisclosures of which are herein incorporated by reference for allpurposes.

Although primarily described and illustrated herein as including amonolithic structural layer 98 having opposing faces that are sandwichedbetween a pair of conductive layers 102 and 108, bipolar plateassemblies according to the present invention may include a pair ofdiscrete, or even spaced-apart structural layers 98, such as shown inFIG. 10 in which the bipolar plate assembly is generally indicated at57′. As shown, each structural layer forming bipolar plate assembly 57′includes a face 132 upon which a conductive layer 102 is mounted, andthe structural and/or conductive layers are in electrical communicationvia an interconnect, or linkage 116. In the illustrated embodiment,interconnect, or linkage(s) 116 may include any suitable structure forconducting charge between an anode region of a first working cell and acathode region of a second working cell. The bipolar plate assemblyshown in FIG. 10 may be configured the same as the previously describedbipolar plate assemblies, and as such may include any of the elements,subelements, materials of construction and/or variations discussedabove. The region between the internal faces 128 of the structurallayers may be at least partially filled with a metal or other materialor materials and/or hollow, such as to provide one or more conduits 124for cooling assemblies 120.

Fuel cell stack 10 may include virtually any number of working cells andcooling assemblies. The stack is capable of outputting relatively moreelectric current as additional working cells are added to the stack.Similarly, the stack may dissipate relatively more heat as more coolingassemblies are added. At the same time, the stack can be made relativelysmaller and lighter when fewer working cells and/or cooling assembliesare used. The optimum compromise of size, weight, energy output, andoperating temperature may vary depending on the desired application. Asexplained herein, it is within the scope of the invention to design afuel cell system for various applications, such as by selectivelychoosing the number and arrangement of working cells compared to coolingassemblies and/or the materials used to construct the bipolar plateassemblies.

As discussed, bipolar plate assemblies 57 according to the presentinvention include a structural layer 98 upon which one or moreconductive layers 102 and/or 108 are mounted. For example, and as shownby referring back to FIG. 5, structural layer 98 is shown abuttingconductive layer 102 at a first transitional region 134, and conductivelayer 108 abuts structural layer 98 at a second transitional region 136.When the layers are physically mounted against each other, such as beingplated, adhered, welded or otherwise physically or mechanically securedtogether, the transitional regions comprise the interface between theabutting surfaces of the layers, at which the composition of the bipolarplate assembly abruptly changes between structural metal 100 andconductive metal 104 (and/or 104′). An example of such a configurationis shown in FIG. 11. As shown, structural metal 100 is schematicallyillustrated with black dots, and conductive metal 104 (or 104′) isschematically illustrated with white dots. To provide an additionalgraphical illustration of the fact that the flow fields of bipolar plateassemblies according to the present invention may extend completely orpartially through the corresponding conductive layers, FIG. 11illustrates each of these examples.

It is within the scope of the invention, however, that the structuraland conductive layer(s) may be secured together by a cladding process,in which case the transition region extends within both the structuraland the conductive layers as a result of the cladding process, whichcauses intermetallic diffusion between the structural metal and theconductive metal(s). This intermetallic diffusion is schematicallyillustrated in FIG. 12, in which the comingling of the black and whitedots schematically illustrates the intermetallic diffusion that hasoccurred between the metals, or layers, during the cladding process. Incontrast, compare FIG. 11, in which there is no diffusion, orcomingling, of the metals. As a clarification, and as used herein,“cladding” is meant to refer to processes by which two metals aresecured together through a process that results in intermetallicdiffusion of the metals, typically with an overall reduction inthickness of the unclad layers. Securing the conductive and structurallayers together by cladding may also be referred to as diffusion bondingthe layers together. Non-exclusive examples of suitable claddingprocesses include roll cladding and explosive cladding. When bipolarplate assembly 57 includes a structural layer 98 to which conductivelayers 102 and 108 are clad, the conductive layers may be clad using thesame or different mechanisms.

A benefit of a cladding process is that it increases the electricalconductivity between the structural and conductive layers when either ofthe layers is formed from a metal that tends to oxidize and thereby forma surface oxide layer. For example, if structural layer 98 is made oftitanium, a metal that forms a surface oxide layer that decreases theoverall electrical conductivity of structural layer 98,intermetallically diffusing the titanium structural layer with aconductive layer exposes virgin titanium metal to the conductive metal,thereby decreasing the effect of the titanium's surface oxide layer.Cladding the metals also may increase electrical conductivity even if nosurface oxide layer is present. The intermetallically diffused metalsare more intimately connected, and are better suited for conductingelectricity than unclad, or unfused, metals. Increasing the conductivitybetween the structural metal and the conductive metal is useful becausethe structural metal typically has a relatively high strength-to-weightratio compared to the conductive metal, and the conductive metaltypically has a more favorable electrical contact resistance compared tothe structural metal. When clad together, the resulting bipolar plateassembly enjoys the favorable strength and weight characteristics of thestructural metal, while simultaneously enjoying the favorable contactconductivity of the conductive metal and the lowered resistance betweenthe structural and conductive metals. In particular, when titanium andstainless steel are used, the bipolar plate assembly hasstrength-to-weight characteristics of titanium and electricalconductivity characteristics of stainless steel without sufferinggreatly from the comparatively low strength-to-weight ratio of stainlesssteel or the comparatively lower electrical conductivity of titanium,namely, titanium that has a surface oxide layer.

FIG. 13 shows a schematic representation of a cladding process in whichconductive layer 102 and structural layer 98 are clad, orintermetallically diffused, together. Before cladding, conductive layer102 and structural layer 98 have a collective thickness t₁. Aftercladding, conductive layer 102 and structural layer 98 have a collectivethickness t₂, which is less than t₁. This contrasts other methods ofjoining the layers such as via plating, welding, an adhesive, orphysical abutment, in which case t₂ may actually be greater than t₁.FIG. 14 graphically depicts a cladding process in which conductivelayers 102 and 108 are clad on opposite faces 132 of structural layer98. Although structural and conductive layers 98, 102 and 108 have beenillustrated in FIGS. 13 and 14 (and elsewhere herein) as having the sameindividual thicknesses, it is within the scope of the invention that theindividual thicknesses of these layers may vary.

FIGS. 15 and 16 schematically depict a portion of bipolar plate assembly57 before and after a flow field 87 has been established. The followingdiscussion refers to flow field 87 in conductive layer 102, but itshould be understood that it also applies to a flow field in conductivelayer 108, such as in embodiments of assembly 57 that include conductivelayers clad onto opposing faces of the structural layer. When thestructural and conductive layers are clad together, the flow field(s)is(are) typically created in the resulting bipolar plate assembly afterthe layers are clad together. However, in some embodiments of theinvention, such as embodiments in which the layers are not cladtogether, the flow fields may be created prior to joining the layerstogether.

Regardless of whether the bipolar plate assembly includes clad or uncladlayers, an example of a suitable method for creating flow fields 87 isto sacrificially etch conductive layer 102. Sacrificial etching istypically performed by positioning an etching mask on the conductivelayer and exposing the conductive layer to an etchant configured toreact with the conductive layer. The reaction causes conductive metalthat is not shielded by the etching mask to become disassociated fromthe remaining conductive layer. In this manner, the mask controls whatportions of the conductive layer are etched. The etchant may be sprayedor otherwise applied against the conductive layer and mask so that theconductive layer is exposed to fresh etchant as the reaction takesplace. The reaction with the conductive layer may be facilitated byheating the etchant. It should be understood that varying theconcentration and composition of the etchant and/or the amount of timethe conductive layer is exposed to the etchant will affect the amount ofthe conductive layer (and in some embodiments, the structural layer)that is removed. For example, the conductive layer may pass on aconveyor under nozzles adapted to spray etchant, and the size of theflow field channels resulting from the etchant spray may be controlledby adjusting the speed of the conveyor.

Because the structural and conductive layers are formed from differentmaterials, it is within the scope of the invention that an etchant maybe used that will react with and thereby remove the conductive layerwhile being at least substantially, if not completely, unreactive withthe structural layer. A benefit of such a construction and process isthat the maximum depth of the flow fields is predetermined by thethickness of the conductive layer. Therefore, in such an embodiment,flow field(s) can be etched to a uniform depth without having toprecisely control the concentration and exposure time of the etchant; atleast not to the degree necessary when the bipolar plate assembly isformed from a single metal or a generally uniform mixture of metals. Inthis latter scenario, even careful control of these variables stillmakes it very difficult, if not impossible, to initially obtain uniformflow field depths or other dimensions. For example, as the etchantremoves material from the bipolar plate assembly, the concentration ofthe etchant decreases. Similarly, the temperature of the etchant and thecorresponding region of the bipolar plate assembly tends to increaseduring the etching process, as this is an exothermic process and thischange in temperature may affect the rate at which metal is removedand/or the shape of the resulting flow field.

Returning to the selective etching discussed above, the etchant maysacrificially etch all the way through the conductive layer, such aslayers 102 or 108, in a pattern controlled by the etching mask. However,because the etchant is unreactive with structural layer 98, the depth ofthe flow field is limited to the depth of the conductive layer.Therefore, the depth of the flow field is set to equal the depth of theconductive layer. Aqueous ferric chloride has proven to be a suitableetchant when the conductive layer is made of stainless steel and thestructural layer is made of titanium. Ferric chloride will etch throughstainless steel while leaving titanium unetched or at most substantiallyunetched. As used herein, “unetched” is meant to include no removal ofmetal from the structural layer, and de minimis removal, such as removalof essentially only a surface oxide layer, while “substantiallyunetched” is meant to refer to a comparatively smaller removal of metalfrom the structural layer than would comparatively be removed from aconductive layer. For example, an etchant that removes approximately 90%less material from structural metal 100 than conductive metal 104 or104′ during the same time period may be described as a suitable etchantthat will form a flow field in the bipolar plate assembly by removingthe conductive layer and leaving the structural layer substantiallyunetched.

It is within the scope of the invention to use etchants other thanferric chloride, especially when the conductive layer is not stainlesssteel and/or the structural layer is not titanium. In contrast, ferricchloride will dissolve completely through a bipolar plate assemblyformed completely from stainless steel or aluminum unless theapplication of the etchant is controlled. Similarly, a bipolar plateassembly that is completely formed from titanium requires an etchant,such as hydrofluoric acid (HF), which is very toxic and thereforeincreases the cost, equipment and/or potential risk of employingsacrificial etching to form the flow fields.

FIG. 17 shows, generally at 150, a method of constructing a bipolarplate assembly for use in a fuel cell stack. Method 150 includes, at152, providing a structural layer of a structural metal, such asstructural layer 98 of structural metal 100. As described above, thestructural layer typically is between 0.01 and 0.1 inches thick,although thicker or thinner layers may be used. The structural metal isusually selected from metals with a high strength-to-weight ratio, suchas titanium, vanadium, and/or their alloys.

The method further includes, at 154, connecting a conductive layer of aconductive metal to the structural layer. The conductive layer istypically between 0.01 inches and 0.1 inches thick, although thicker orthinner layers may be used. The conductive metal may be selected frommetals with a low electrical contact resistance, such as conventionalstainless steels. In some embodiments, the connecting step includesdiffusion bonding the layers through a cladding process in which themetals forming the layers are intermetallically diffused. It should beunderstood that the connecting step may, but does not necessarily,include connecting a second conductive layer to the structural layer,either at the same or a different time as the first conductive layer.

The method further includes, at 156, etching a flow field into theconductive layer (or the conductive layers, and either at the same timeor at different times) while leaving the connected structural layer atmost substantially unetched. As described above, a flow field may beestablished by sacrificially etching the conductive layer with anetchant configured to react with the conductive layer. The structurallayer may be left unetched or at most substantially unetched byselecting an etchant that does not easily react with the structurallayer. In this way, the structural layer is left at most substantiallyunetched, even when a flow field is etched all the way though theconductive layer. As discussed, when the conductive metal is stainlesssteel and the structural metal is titanium, ferric chloride may be usedas an etchant.

As discussed above, some fuel cell stacks utilize hydrogen gas as areactant, or fuel. Therefore, a fuel cell stack 10 according to thepresent invention may be coupled with a source 46 of hydrogen gas 42(related delivery systems and balance of plant components) to form afuel cell system. A fuel cell system according to the present inventionis shown in FIG. 18 and generally indicated at 210. As discussedpreviously with respect to FIG. 2, examples of sources 46 of hydrogengas 42 include a storage device 211 that contains a stored supply ofhydrogen gas, as indicated in dashed lines in FIG. 18. Examples ofsuitable storage devices 211 include pressurized tanks and hydride beds.An additional or alternative source 46 of hydrogen gas 42 is the productstream from a fuel processor, which produces hydrogen by reacting a feedstream to produce reaction products from which the stream containinghydrogen gas 42 is formed. As shown in solid lines in FIG. 18, system210 includes at least one fuel processor 212 and at least one fuel cellstack 10. Fuel processor 212 is adapted to produce a product hydrogenstream 254 containing hydrogen gas 42 from a feed stream 216 containingat least one feedstock. The fuel cell stack is adapted to produce anelectric current from the portion of product hydrogen stream 254delivered thereto. In the illustrated embodiment, a single fuelprocessor 212 and a single fuel cell stack 10 are shown; however, it iswithin the scope of the invention that more than one of either or bothof these components may be used. It should be understood that thesecomponents have been schematically illustrated and that the fuel cellsystem may include additional components that are not specificallyillustrated in the Figures, such as air delivery systems, heatexchangers, heating assemblies and the like. As also shown, hydrogen gasmay be delivered to stack 10 from one or more of fuel processor 212 andstorage device 211, and hydrogen from the fuel processor may bedelivered to one or more of the storage device and stack 10. Some or allof stream 254 may additionally, or alternatively, be delivered, via asuitable conduit, for use in another hydrogen-consuming process, burnedfor fuel or heat, or stored for later use.

Fuel processor 212 is any suitable device that produces hydrogen gasfrom the feed stream. Examples of suitable mechanisms for producinghydrogen gas from feed stream 216 include steam reforming andautothermal reforming, in which reforming catalysts are used to producehydrogen gas from a feed stream containing a carbon-containing feedstockand water. Other suitable mechanisms for producing hydrogen gas includepyrolysis and catalytic partial oxidation of a carbon-containingfeedstock, in which case the feed stream does not contain water. Stillanother suitable mechanism for producing hydrogen gas is electrolysis,in which case the feedstock is water. Examples of suitablecarbon-containing feedstocks include at least one hydrocarbon oralcohol. Examples of suitable hydrocarbons include methane, propane,natural gas, diesel, kerosene, gasoline and the like. Examples ofsuitable alcohols include methanol, ethanol, and polyols, such asethylene glycol and propylene glycol.

Feed stream 216 may be delivered to fuel processor 212 via any suitablemechanism. Although only a single feed stream 216 is shown in FIG. 18,it should be understood that more than one stream 216 may be used andthat these streams may contain the same or different feedstocks. Whencarbon-containing feedstock 218 is miscible with water, the feedstock istypically, but not required to be, delivered with the water component offeed stream 216, such as shown in FIG. 18. When the carbon-containingfeedstock is immiscible or only slightly miscible with water, thesefeedstocks are typically delivered to fuel processor 212 in separatestreams, such as shown in FIG. 19. In FIGS. 18 and 19, feed stream 216is shown being delivered to fuel processor 212 by a feedstock deliverysystem 217, which will be discussed in more detail subsequently.

In many applications, it is desirable for the fuel processor to produceat least substantially pure hydrogen gas. Accordingly, the fuelprocessor may utilize a process that inherently produces sufficientlypure hydrogen gas, or the fuel processor may include suitablepurification and/or separation devices that remove impurities from thehydrogen gas produced in the fuel processor. As another example, thefuel processing system or fuel cell system may include purificationand/or separation devices downstream from the fuel processor. In thecontext of a fuel cell system, the fuel processor preferably is adaptedto produce substantially pure hydrogen gas, and even more preferably,the fuel processor is adapted to produce pure hydrogen gas. For thepurposes of the present invention, substantially pure hydrogen gas isgreater than 90% pure, preferably greater than 95% pure, more preferablygreater than 99% pure, and even more preferably greater than 99.5% pure.Suitable fuel processors are disclosed in U.S. Pat. Nos. 6,221,117,5,997,594, 5,861,137, and pending U.S. patent application Ser. No.09/802,361. The complete disclosures of the above-identified patents andpatent application are hereby incorporated by reference for allpurposes.

For purposes of illustration, the following discussion will describefuel processor 212 as a steam reformer adapted to receive a feed stream216 containing a carbon-containing feedstock 218 and water 220. However,it is within the scope of the invention that fuel processor 212 may takeother forms, as discussed above. An example of a suitable steam reformeris shown in FIG. 20 and indicated generally at 230. Reformer 230includes a reforming, or hydrogen-producing, region 232 that includes asteam reforming catalyst 234. Alternatively, reformer 230 may be anautothermal reformer that includes an autothermal reforming catalyst. Inreforming region 232, a reformate stream 236 is produced from the waterand carbon-containing feedstock in feed stream 216. The reformate streamtypically contains hydrogen gas and other gases. In the context of afuel processor generally, a mixed gas stream that contains hydrogen gasand other gases is produced from the feed stream. The mixed gas, orreformate, stream is delivered to a separation region, or purificationregion, 238, where the hydrogen gas is purified. In separation region238, the hydrogen-containing stream is separated into one or morebyproduct streams, which are collectively illustrated at 240 and whichtypically include at least a substantial portion of the other gases, anda hydrogen-rich stream 242, which contains at least substantially purehydrogen gas. The separation region may utilize any separation process,including a pressure-driven separation process. In FIG. 20,hydrogen-rich stream 242 is shown forming product hydrogen stream 254.

An example of a suitable structure for use in separation region 238 is amembrane module 244, which contains one or more hydrogen permeablemembranes 246. Examples of suitable membrane modules formed from aplurality of hydrogen-selective metal membranes are disclosed in U.S.Pat. No. 6,319,306, the complete disclosure of which is herebyincorporated by reference for all purposes. In the '306 patent, aplurality of generally planar membranes are assembled together into amembrane module having flow channels through which an impure gas streamis delivered to the membranes, a purified gas stream is harvested fromthe membranes and a byproduct stream is removed from the membranes.Gaskets, such as flexible graphite gaskets, are used to achieve sealsaround the feed and permeate flow channels. Also disclosed in theabove-identified application are tubular hydrogen-selective membranes,which also may be used. Other suitable membranes and membrane modulesare disclosed in the above-incorporated patents and applications, aswell as U.S. patent application Ser. Nos. 10/067,275, now U.S. Pat. No.6,562,111 issued May 13, 2003 and 10/027,509 now U.S. Pat. No. 6,537,352issued Mar. 23, 2003, the complete disclosures of which are herebyincorporated by reference in their entirety for all purposes.Membrane(s) 246 may also be integrated directly into thehydrogen-producing region or other portion of fuel processor 212.

The thin, planar, hydrogen-permeable membranes are preferably composedof palladium alloys, most especially palladium with 35 wt % to 45 wt %copper, such as approximately 40 wt % copper. These membranes, whichalso may be referred to as hydrogen-selective membranes, are typicallyformed from a thin foil that is approximately 0.001 inches thick. It iswithin the scope of the present invention, however, that the membranesmay be formed from hydrogen-selective metals and metal alloys other thanthose discussed above, hydrogen-permeable and selective ceramics, orcarbon compositions. The membranes may have thicknesses that are largeror smaller than discussed above. For example, the membrane may be madethinner, with commensurate increase in hydrogen flux. Thehydrogen-permeable membranes may be arranged in any suitableconfiguration, such as arranged in pairs around a common permeatechannel as is disclosed in the incorporated patent applications. Thehydrogen permeable membrane or membranes may take other configurationsas well, such as tubular configurations, which are disclosed in theincorporated patents.

Another example of a suitable pressure-separation process for use inseparation region 238 is pressure swing adsorption (PSA). In a pressureswing adsorption (PSA) process, gaseous impurities are removed from astream containing hydrogen gas. PSA is based on the principle thatcertain gases, under the proper conditions of temperature and pressure,will be adsorbed onto an adsorbent material more strongly than othergases. Typically, it is the impurities that are adsorbed and thusremoved from reformate stream 236. The success of using PSA for hydrogenpurification is due to the relatively strong adsorption of commonimpurity gases (such as CO, CO₂, hydrocarbons including CH₄, and N₂) onthe adsorbent material. Hydrogen adsorbs only very weakly and sohydrogen passes through the adsorbent bed while the impurities areretained on the adsorbent material. Impurity gases such as NH₃, H₂S, andH₂O adsorb very strongly on the adsorbent material and are thereforeremoved from stream 236 along with other impurities. If the adsorbentmaterial is going to be regenerated and these impurities are present instream 236, separation region 238 preferably includes a suitable devicethat is adapted to remove these impurities prior to delivery of stream236 to the adsorbent material because it is more difficult to desorbthese impurities.

Adsorption of impurity gases occurs at elevated pressure. When thepressure is reduced, the impurities are desorbed from the adsorbentmaterial, thus regenerating the adsorbent material. Typically, PSA is acyclic process and requires at least two beds for continuous (as opposedto batch) operation. Examples of suitable adsorbent materials that maybe used in adsorbent beds are activated carbon and zeolites, especially5 Å (5 angstrom) zeolites. The adsorbent material is commonly in theform of pellets and it is placed in a cylindrical pressure vesselutilizing a conventional packed-bed configuration. It should beunderstood, however, that other suitable adsorbent materialcompositions, forms and configurations may be used.

As discussed, it is also within the scope of the invention that at leastsome of the purification of the hydrogen gas is performed intermediatethe fuel processor and the fuel cell stack. Such a construction isschematically illustrated in dashed lines in FIG. 20, in which theseparation region 238′ is depicted downstream from the shell 231 of thefuel processor.

Reformer 230 may, but does not necessarily, additionally oralternatively, include a polishing region 248, such as shown in FIG. 21.As shown, polishing region 248 receives hydrogen-rich stream 242 fromseparation region 238 and further purifies the stream by reducing theconcentration of, or removing, selected compositions therein. Forexample, when stream 242 is intended for use in a fuel cell stack, suchas stack 10, compositions that may damage the fuel cell stack, such ascarbon monoxide and carbon dioxide, may be removed from thehydrogen-rich stream. The concentration of carbon monoxide should beless than 10 ppm (parts per million). Preferably, the system limits theconcentration of carbon monoxide to less than 5 ppm, and even morepreferably, to less than 1 ppm. The concentration of carbon dioxide maybe greater than that of carbon monoxide. For example, concentrations ofless than 25% carbon dioxide may be acceptable. Preferably, theconcentration is less than 10%, and even more preferably, less than 1%.Especially preferred concentrations are less than 50 ppm. It should beunderstood that the acceptable maximum concentrations presented hereinare illustrative examples, and that concentrations other than thosepresented herein may be used and are within the scope of the presentinvention. For example, particular users or manufacturers may requireminimum or maximum concentration levels or ranges that are differentthan those identified herein. Similarly, when fuel processor 212 is notused with a fuel cell stack, or when it is used with a fuel cell stackthat is more tolerant of these impurities, then the product hydrogenstream may contain larger amounts of these gases.

Region 248 includes any suitable structure for removing or reducing theconcentration of the selected compositions in stream 242. For example,when the product stream is intended for use in a PEM fuel cell stack orother device that will be damaged if the stream contains more thandetermined concentrations of carbon monoxide or carbon dioxide, it maybe desirable to include at least one methanation catalyst bed 250. Bed250 converts carbon monoxide and carbon dioxide into methane and water,both of which will not damage a PEM fuel cell stack. Polishing region248 may also include another hydrogen-producing device 252, such asanother reforming catalyst bed, to convert any unreacted feedstock intohydrogen gas. In such an embodiment, it is preferable that the secondreforming catalyst bed is upstream from the methanation catalyst bed soas not to reintroduce carbon dioxide or carbon monoxide downstream ofthe methanation catalyst bed.

Steam reformers typically operate at temperatures in the range of 200°C. and 700° C., and at pressures in the range of 50 psi and 1000 psi,although temperatures and pressures outside of these ranges are withinthe scope of the invention, such as depending upon the particular typeand configuration of fuel processor being used. Any suitable heatingmechanism or device may be used to provide this heat, such as a heater,burner, combustion catalyst, or the like. The heating assembly may beexternal the fuel processor or may form a combustion chamber that formspart of the fuel processor. The fuel for the heating assembly may beprovided by the fuel processing system, by the fuel cell system, by anexternal source, or any combination thereof.

In FIGS. 20 and 21, reformer 230 is shown including a shell 231 in whichthe above-described components are contained. Shell 231, which also maybe referred to as a housing, enables the fuel processor, such asreformer 230, to be moved as a unit. It also protects the components ofthe fuel processor from damage by providing a protective enclosure andreduces the heating demand of the fuel processor because the componentsof the fuel processor may be heated as a unit. Shell 231 may, but doesnot necessarily, include insulating material 233, such as a solidinsulating material, blanket insulating material, or an air-filledcavity. It is within the scope of the invention, however, that thereformer may be formed without a housing or shell. When reformer 230includes insulating material 233, the insulating material may beinternal the shell, external the shell, or both. When the insulatingmaterial is external a shell containing the above-described reforming,separation and/or polishing regions, the fuel processor may furtherinclude an outer cover or jacket external the insulation.

It is further within the scope of the invention that one or more of thecomponents may either extend beyond the shell or be located external atleast shell 231. For example, and as schematically illustrated in FIG.21, polishing region 248 may be external shell 231 and/or a portion ofreforming region 232 may extend beyond the shell. Other examples of fuelprocessors demonstrating these configurations are illustrated in theincorporated references and discussed in more detail herein.

Although fuel processor 212, feedstock delivery system 217, fuel cellstack 10 and energy-consuming device 52 may all be formed from one ormore discrete components, it is also within the scope of the inventionthat two or more of these devices may be integrated, combined orotherwise assembled within an external housing or body. For example, afuel processor and feedstock delivery system may be combined to providea hydrogen-producing device with an on-board, or integrated, feedstockdelivery system, such as schematically illustrated at 226 in FIG. 18.Similarly, a fuel cell stack may be added to provide anenergy-generating device with an integrated feedstock delivery system,such as schematically illustrated at 227 in FIG. 18.

Fuel cell system 210 may additionally be combined with anenergy-consuming device, such as device 52, to provide the device withan integrated, or on-board, energy source. For example, the body of sucha device is schematically illustrated in FIG. 18 at 228. Examples ofsuch devices include a motor vehicle, such as a recreational vehicle,automobile, boat or other seacraft, and the like, a dwelling, such as ahouse, apartment, duplex, apartment complex, office, store or the like,or self-contained equipment, such as an appliance, light, tool,microwave relay station, transmitting assembly, remote signaling orcommunication equipment, etc.

INDUSTRIAL APPLICABILITY

The invented bipolar plate assemblies, methods for forming the same, andfuel cells and fuel cell stacks containing the same are applicable tothe fuel processing, fuel cell and other industries in which fuel cellsare utilized.

It is believed that the disclosure set forth above encompasses multipledistinct inventions with independent utility. While each of theseinventions has been disclosed in its preferred form, the specificembodiments thereof as disclosed and illustrated herein are not to beconsidered in a limiting sense as numerous variations are possible. Thesubject matter of the inventions includes all novel and non-obviouscombinations and subcombinations of the various elements, features,functions and/or properties disclosed herein. Similarly, where theclaims recite “a” or “a first” element or the equivalent thereof, suchclaims should be understood to include incorporation of one or more suchelements, neither requiring nor excluding two or more such elements.

It is believed that the following claims particularly point out certaincombinations and subcombinations that are directed to one of thedisclosed inventions and are novel and non-obvious. Inventions embodiedin other combinations and subcombinations of features, functions,elements and/or properties may be claimed through amendment of thepresent claims or presentation of new claims in this or a relatedapplication. Such amended or new claims, whether they are directed to adifferent invention or directed to the same invention, whetherdifferent, broader, narrower or equal in scope to the original claims,are also regarded as included within the subject matter of theinventions of the present disclosure.

1. A method of constructing a fuel cell stack including at least onebipolar plate assembly, the method comprising: constructing at least onebipolar plate assembly, wherein the step of constructing comprises:providing a structural layer of a structural metal; connecting aconductive layer of a conductive metal to the structural layer, whereinthe structural metal and the conductive metal have differentcompositions; and etching a flow field into the conductive layer whileleaving the connected structural layer at most substantially unetched;providing a pair of end plates and at least one membrane-electrodeassembly; and assembling a fuel cell stack comprising the at least onebipolar plate assembly and the at least one membrane-electrode assemblysupported between the pair of end plates.
 2. The method of claim 1,wherein connecting a conductive layer to the structural layer includesconnecting the layers via intermetallic diffusion.
 3. The method ofclaim 2, wherein the conductive layer and structural layer are connectedvia roll cladding.
 4. The method of claim 2, wherein the conductivelayer and structural layer are connected via explosive cladding.
 5. Themethod of claim 2, wherein the structural metal includes titanium. 6.The method of claim 2, wherein the conductive metal includes stainlesssteel.
 7. The method of claim 2, wherein the structural metal includestitanium, and the conductive metal includes stainless steel.
 8. Themethod of claim 2, wherein the flow field is etched with an etchantselected to react with the conductive metal while leaving the structuralmetal at most substantially unetched.
 9. The method of claim 8, whereinthe etchant includes ferric chloride.
 10. The method of claim 8, whereinthe etchant is selected to be unreactive to the structural metal. 11.The method of claim 2, wherein the conductive layer has a thickness andthe flow field has a depth that is equal to the thickness of theconductive layer.
 12. The method of claim 2, wherein the structuralmetal has a higher strength-to-weight ratio than the conductive metal.13. The method of claim 2, wherein the conductive metal has a lowerelectrical contact resistance than the structural metal.
 14. The methodof claim 1, wherein the structural metal includes titanium.
 15. Themethod of claim 1, wherein the conductive metal includes stainlesssteel.
 16. The method of claim 1, wherein the structural metal includestitanium, and the conductive metal includes stainless steel.
 17. Themethod of claim 1, wherein the flow field is etched with an etchantselected to react with the conductive metal while leaving the structuralmetal at most substantially unetched.
 18. The method of claim 17,wherein the etchant includes ferric chloride.
 19. The method of claim17, wherein the etchant is selected to be unreactive to the structuralmetal.
 20. The method of claim 1, further comprising connecting a secondconductive layer of the conductive metal to the structural layer andetching a second flow field into the second conductive layer whileleaving the connected structural layer at most substantially unetched,wherein the conductive layer and the second conductive layer sandwichthe structural layer.
 21. The method of claim 1, wherein the conductivelayer has a thickness and the flow field has a depth that is equal tothe thickness of the conductive layer.
 22. The method of claim 1,wherein the structural metal has a higher strength-to-weight ratio thanthe conductive metal.
 23. The method of claim 1, wherein the conductivemetal has a lower electrical contact resistance than the structuralmetal.
 24. The method of claim 1, wherein the method includes repeatingthe constructing step to construct a plurality of bipolar plateassemblies, wherein the providing step includes providing a plurality ofmembrane-electrode assemblies, and further wherein the assembling stepincludes assembling the fuel cell stack with the plurality of bipolarplate assemblies and the plurality of membrane-electrode assembliessupported between the pair of end plates.
 25. The method of claim 24,wherein the assembling includes positioning the plurality of bipolarplate assemblies in an alternating relationship with the plurality ofmembrane-electrode assemblies.
 26. The method of claim 1, wherein theflow field is embodied in a channel formed in the conductive layer. 27.The method of claim 1, wherein the flow field is embodied in a pluralityof channels formed in the conductive layer.
 28. The method of claim 27,wherein the channels each have a length and the channels are arrangedparallel to one another through at least a portion of the lengths of thechannels.